Automatic visual inspection machine
Maker Nidec Lead
Model Rwi-200
Model year 2018
External Dimensions 1800X1800X1800
Exhibition hall Kyushu Technical Center
price Price on request
Inquiry Number K50773
Mechanical Specifications
Gold Bump
Solder bump copper bump height
Gold bump top surface unevenness defect
Solder bump outline
High-speed measurement device for bump position and wafer surface defects 6/8 inch orientation flat
Notchable
300 to 1,000 μm
Bump size Gold: 10 to 500 μm wide
Solder, copper bump: diameter φ10 to 750μm
Bump height Gold: 5 to 100 μm
Solder, copper 10 to 100 μm
With 2D/SD inspection optics
Output data TSK format
Report output CSV format
MODEL: RMZ-1133 S/N A000001871
Attachments
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