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Wafer Bonding Equipment - Electronic ballast EVG520

Product Specifications

Maker Electronic ballast

Model EVG520

Model year 2005

Condition Used

Showroom Information

Exhibition hall etc

Price & Inquiry

price Price Inquiry

Inquiry Number M40639

Mechanical Specifications

50/60Hz 3-phase 200V

Attachments

Product Overview

Electronic ballast EVG520 is a used test & measurement equipment item handled by ASKINDEX Korea. This listing has sold, but you can ask about restock or a similar unit, and request a quote.

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Electronic ballast EVG520 Wafer Bonding Equipment - ASKINDEX Korea

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